| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f9f82ed2928dd885a8fa6604e5c647f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y04S40-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F21-554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F21-87 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F21-55 |
| filingDate |
2015-11-18^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-02-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea1990df2c18adeb3727a5555c73473a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49cd22a3d1342017072d858f7c1b8083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bb5e1cda6c66558f16ed82e5adb5947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_390bae20443ebdb6cb0971ed96a56e9c |
| publicationDate |
2018-02-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I613565-B |
| titleOfInvention |
IC chip package disable device |
| abstract |
A chip package includes: an IC substrate, wherein the IC substrate includes at least one electronic device; a photovoltaic cell, wherein when the photovoltaic cell is exposed to light, it generates a current; the light blocking mask, wherein only the chip package is mounted on the circuit board The upper time blocking mask prevents light from illuminating the photovoltaic cell, and the light blocking mask stops preventing light from illuminating the photovoltaic cell when the chip package is removed from the circuit board; and the disable logic wherein the current generated by the photovoltaic cell in response to detaching the chip package from the circuit board Causes the disable logic to disable the IC substrate. |
| priorityDate |
2014-11-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |