| abstract |
When the display device has higher definition, the number of pixels, gate lines, and signal lines will increase; when the number of gate lines and signal lines increases, the problem of higher manufacturing costs will arise because it is difficult to use A bonding method or the like is used to mount an IC chip including a driver circuit for driving gate lines and signal lines. The pixel portion and a driver circuit for driving the pixel portion are provided on the same substrate, and at least a part of the driver circuit includes a thin film transistor using an oxide semiconductor, and the oxide semiconductor is inserted in the oxide semiconductor. Between the upper and lower gate electrodes; therefore, when the pixel portion and the driver portion are disposed on the same substrate, the manufacturing cost can be reduced. |