| abstract |
The invention discloses an ethylene benzyl quinone imine resin which can be combined with other components to form a resin composition for forming, for example, a prepreg, a resin film, a resin film with a copper foil, a laminate or a printed circuit board. Further, it is improved in one or more aspects such as resin fluidity, rubber filling property, flame retardancy, glass transition temperature, heat resistance, dielectric constant, dielectric loss, and interlayer adhesion strength. Further, the present invention also discloses a process for producing the above vinylbenzyl ruthenylene resin, a prepolymer thereof, a resin composition containing the above vinylbenzyl ruthenium imide resin and/or a prepolymer thereof, and a product thereof. |