| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_50d058fc441db0bf12f06052877d3e92 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0714
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0735 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00246 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2017-02-24^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61d78e97b2b7264a99796c791ba80fc1 |
| publicationDate |
2018-12-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I642615-B |
| titleOfInvention |
Integrated MEMS sensor and circuit |
| abstract |
The present application relates to an integrated MEMS sensor, which includes a MEMS sensor structure formed from a plurality of sensor layers and at least one circuit component formed from a plurality of circuit (CMOS) layers. The integrated MEMS sensor further includes a conductive shell integrated with the sensor layers and the circuit layers. The at least one circuit component is tied inside the conductive case, and the MEMS sensor structure is outside the case. |
| priorityDate |
2016-02-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |