http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I649798-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-361 |
| filingDate | 2017-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-02-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b120230cd6ead0139e4906741c898d |
| publicationDate | 2019-02-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I649798-B |
| titleOfInvention | Mask integrated surface protection tape |
| abstract | The invention relates to a mask-integrated surface protection tape, which is used for a semiconductor wafer manufacturer including the following steps (a) to (d), and the mask-integrated surface protection tape has sequentially on a base film In the step (b) of the radiation-curable adhesive layer and the radiation-curable masking material layer, before the radiation is irradiated, the adhesive layer and the masking material layer are separated, and after the radiation is radiated, the masking material layer Peel off from the pattern surface; [steps (a) ~ (d)]nn n n (a) In a state where the mask-integrated surface protective tape is bonded to the pattern surface side of the semiconductor wafer, the back surface of the semiconductor wafer is ground, and the wafer fixing tape is bonded to the back surface of the ground semiconductor wafer. The step of supporting and fixing by a ring frame; (b) The substrate film and the above-mentioned adhesive layer are peeled off from the mask-integrated surface protection tape integrally to expose the mask material layer on the surface, and then the mask is cut by laser. The step of opening the scribe line of the semiconductor wafer in the cover material layer corresponding to the scribe line of the semiconductor wafer; (c) Dividing the semiconductor wafer with the scribe line using SF 6 plasma to singulate the semiconductor wafer into semiconductor wafers A plasma cutting step; and (d) an ashing step for removing the masking material layer by an O 2 plasma. |
| priorityDate | 2016-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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