| abstract |
A UV laser processing method for copper coils and a structure thereof, wherein a thick copper having a thickness of 100 μm or more is fixed to a position and flattened by a fixing jig, and then a UV laser is passed through a spiral The copper wire is cut on the thick copper, and the connecting bridge which is not cut by the UV laser and the multi-channel groove on both sides of the connecting bridge are left on the thick copper after cutting, and finally the connecting bridge is cut off by the UV laser. Further, a spiral copper coil is obtained. |