Metal foil, metal foil with release layer, laminated body, printed wiring board, semiconductor package, electronic device, and manufacturing method of printed wiring board
The present invention provides a metal foil which is capable of physically peeling a resin substrate when the metal foil is attached to a resin substrate by providing a release layer on the metal foil, thereby removing the metal foil from the resin substrate. In the step, the metal foil can be removed at a better cost without damaging the contour of the surface of the metal foil transferred to the surface of the resin substrate, and resins with different resin components can be adhered to each other with good adhesion. . The metal foil of the present invention has surface asperities on at least one surface having a root mean square height Sq of 0.25 to 1.6 μm.