| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2015-09-25^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-09-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d857861e23ce21d53c59c1a5b20a807d |
| publicationDate |
2019-09-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I672368-B |
| titleOfInvention |
Grinding composition |
| abstract |
An object of the present invention is to provide a polishing composition which can sufficiently control the polishing rate of a Si-containing material.nn n n The solution of the present invention provides a polishing composition comprising a pH adjuster and an organic compound, and a pH system of more than 7.5, wherein the organic compound is represented by the following formula (1). n n n Among them, A is an electron attracting group. |
| priorityDate |
2014-09-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |