| abstract |
A photosensitive resin composition containing polyimide and polybenzo Azole, polyimide precursor, polybenzo A photosensitive resin composition of one or more alkali-soluble resins and photosensitizers selected from the group consisting of azole precursors and copolymers of two or more polymers selected from the group consisting of the following general formula (1) The indicated compound. The present invention provides a photosensitive resin composition whose cured film is excellent in adhesion to metal materials, especially copper, and exhibits high chemical resistance even when fired at a low temperature. |