http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I687984-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa0f2776bcc27d5099aa97f3212e1681 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0011 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-351 |
| filingDate | 2015-12-10^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03a7e73307d69f3db1c15ea60d84f8cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33145b590124a920c481b1fd4c4ced01 |
| publicationDate | 2020-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I687984-B |
| titleOfInvention | Wafer processing method |
| abstract | Provides that the functional layers of the wafers of the device forming the device divided by the plurality of predetermined dividing lines formed on the surface of the functional layer laminated on the surface of the substrate in a grid-like manner are not peeled, and the substrate does not cause pores or cracks, etc., A method of processing wafers divided along a predetermined dividing line.nn n n n n A wafer processing method is a wafer processing method for forming a device by forming a grid in a plurality of regions divided by a plurality of predetermined dividing lines of a functional layer stacked on a substrate surface, which includes: A predetermined dividing line formed on the wafer, a predetermined interval is set and laser light is irradiated to swell the functional layer along the predetermined dividing line, thereby forming a convex strip forming process of two convex strips, and along two convex strips The sandwiched area is divided into wafers for the convex strip forming process. |
| priorityDate | 2015-01-16^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419484996 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7809 |
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