http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I697058-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c29eca39e4a8fc2d9a9fb44fd3a3a40 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-33181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4878 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4817 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2016-03-30^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e529b60881d2ffc4405f09de73840831 |
| publicationDate | 2020-06-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I697058-B |
| titleOfInvention | Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof |
| abstract | A packaging method for manufacturing a circuit element package with good heat dissipation and high electric power, which includes the following steps: forming array-ordered copper lines on a first copper plate, and forming array-type conduction through mechanical drilling at selected locations Holes; forming a plurality of ordered copper lines on a second copper plate, and then printing conductive adhesive on a set position; positioning the circuit core of the circuit element on one of the conductive adhesives. Next, the positioning and alignment procedure is performed on the copper plate structure that has been printed with conductive paste, and the positioning and alignment of the two copper plate structures and the circuit core are completed. Afterwards, copper pillars of appropriate size are taken and inserted into the opened via holes to complete the connection of the two copper plate structures. After high temperature treatment, the electrical connection between the circuit core and the two copper plate structures is completed. Inject the gas-tight insulation material into the two-process copper plate structure after the assembly, and then process the outer end structure of the two-process copper plate by the etched copper plate process to complete the external copper circuit of the two copper plates, and then follow the upper and lower mold clamping construction steps, An airtight insulating packaging material is applied, and after baking and curing, it is cut to separate individual circuit elements to form the package. |
| priorityDate | 2016-03-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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