| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
| filingDate |
2016-10-18^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b27e655feb07b61e579ac327c61422f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a180a7010fe5abe43aa3b944815db7eb |
| publicationDate |
2020-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I697514-B |
| titleOfInvention |
Polycarbonate imide resin and paste using the resin |
| abstract |
[Question] Provide a polycarbonate imide resin paste that can be used as a solder resist and surface protective layer that simultaneously meets (1) non-nitrogen solvent solubility (2) low warpage (3) bending resistance Or adhesive layer. [Solution] A polycarbonate imine resin (A), characterized in that it contains a composition represented by a specific structural formula (1), a composition represented by a specific structural formula (2), and a specific structural formula ( 3) When the total composition is 200 mol%, the composition represented by the specific structural formula (1) is 10 mol% or more, and the composition represented by the specific structural formula (2) is more than 30 mol% is less than 70 mol%, and the composition represented by the specific structural formula (3) is more than 50 mol%. |
| priorityDate |
2015-10-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |