| abstract |
The invention discloses a resin composition comprising a crosslinking agent, a benzoxazine resin prepolymer and a maleimide resin. The resin composition can be made into various products, such as prepregs, resin films, back-adhesive copper foils, laminates or printed circuit boards, and the substrate reflow shrinkage, T288 heat resistance, ten-layer board T300 heat resistance, dielectric At least one, more or all of the characteristics of loss, tensile force to copper foil, and filling in open areas are improved. |