http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I719123-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24C1-003 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-015 |
| filingDate | 2017-01-23^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3611205ca0d7b85094d8707f585d0bed |
| publicationDate | 2021-02-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I719123-B |
| titleOfInvention | In-situ temperature control during chemical mechanical polishing with a condensed gas |
| abstract | Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the same. More specifically, implementations of the present disclosure relate to in-situ temperature control with a condensed gas during a chemical-mechanical polishing (CMP) process. In one implementation, the method comprises polishing one or more substrates against a polishing surface in the presence of a polishing fluid during a polishing process to remove a portion of a material formed on the one or more substrates. A temperature of the polishing surface is monitored during the polishing process. Carbon dioxide snow is delivered to the polishing surface in response to the monitored temperature to maintain the temperature of the polishing surface at a target value during the polishing process. |
| priorityDate | 2016-02-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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