| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a63da544285d447e12ac3b2180cf7074 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-01-25^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-08-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c86dc86a93ef93712e62f673fae55822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3a63edb6d342203904e1106378eadd0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b597e51e6ff07cf3aed730f49ca5d0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccdb67e4008e954966353b9e4f2b51a9 |
| publicationDate |
2021-08-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I735843-B |
| titleOfInvention |
Micro-electro-mechanical-system microphone package |
| abstract |
A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer. |
| priorityDate |
2018-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |