http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10070521-B2

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filingDate 2013-03-29^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-09-04^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10070521-B2
titleOfInvention Surface-treated copper foil
abstract This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.
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