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filingDate 2015-08-25^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-02-26^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-02-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10215950-B2
titleOfInvention High-strength titanium copper foil and method for producing same
abstract To provide a high-strength titanium-copper foil suitable as a conductive spring material that can be used in an electronic device component such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2 % yield strength of 1200 MPa or more in both directions parallel and perpendicular to a rolling direction, and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to the rolling direction.
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