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filingDate 2017-06-27^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-04-02^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_daed5c64b4ce95933fc75a5de379dbe8
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publicationDate 2019-04-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10249714-B2
titleOfInvention Method of forming epitaxial buffer layer for finFET source and drain junction leakage reduction
abstract A semiconductor device including a gate structure on a channel region portion of a fin structure, and at least one of an epitaxial source region and an epitaxial drain region on a source region portion and a drain region portion of the fin structure. At least one of the epitaxial source region portion and the epitaxial drain region portion include a first concentration doped portion adjacent to the fin structure, and a second concentration doped portion on the first concentration doped portion. The second concentration portion has a greater dopant concentration than the first concentration doped portion. An extension dopant region extending into the channel portion of the fin structure having an abrupt dopant concentration gradient of n-type or p-type dopants of 7 nm per decade or greater.
priorityDate 2014-05-01^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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