http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10340110-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7d9f6506c7848de95c3250dd6ea744bf |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2037-762 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H37-761 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02H5-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02H9-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-0241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H37-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-04 |
| filingDate | 2017-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ee6044b3722c2b9f9f1f87e5b2c95ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6f09e9d82846692f5bc8faa4b12383f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36c5242e1d3aae1b4674b0be7e3fe407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91e1b7c885d5a300a9a6e08be02fef36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db88fa529040fbe75b01a40466734a19 |
| publicationDate | 2019-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-10340110-B2 |
| titleOfInvention | Surge protective device modules including integral thermal disconnect mechanisms and methods including same |
| abstract | A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4213326-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10685805-B2 |
| priorityDate | 2017-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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