| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c8130e8f8f12ebea8a5278b8797b56 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B2203-017 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02N13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02N13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-00 |
| filingDate |
2015-10-06^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1679f50fb1513f1277bf6fa691695c0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34363e332f3eacc61ce8b3ad7e927c69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cec766a979fee19b9324123914e69a8 |
| publicationDate |
2020-05-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10658206-B2 |
| titleOfInvention |
Method of forming a composite substrate for layered heaters |
| abstract |
A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step. |
| priorityDate |
2012-07-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |