| abstract |
A multi-chip module structure (MCM) having improved heat dissipation includes a plurality of semiconductor chips having a front side mounted on a packaging substrate, wherein each semiconductor chip of the plurality of semiconductor chips further includes a through-substrate vias located at a backside of each semiconductor chip of the plurality of semiconductor chips. A plurality of wire bonds is present that provides interconnect between each semiconductor chip of the plurality of semiconductor chips and is located at the backside of each semiconductor chip of the plurality of semiconductor chips. A heat sink is located above a gap containing the plurality of wire bonds, and a cooling element is located on a surface of the heat sink. |