| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_581f0566c3db4e3209c30877d09184db |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-732 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10761
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-1055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10036 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G10K11-168 |
| filingDate |
2018-06-27^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-13^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fd0b66ae294cdf3cc57a54d54a217f4 |
| publicationDate |
2020-10-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10800145-B2 |
| titleOfInvention |
Sound insulation panels having high interlayer thickness factors |
| abstract |
A multiple layer panel having improved sound insulation is disclosed. The multiple layer panel comprises a first rigid substrate having a first thickness H3, a second rigid substrate having a second thickness H1, wherein H3≤H1, and a multiple layer acoustic interlayer having a thickness H2 between the first and second rigid substrates. |
| priorityDate |
2016-10-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |