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filingDate 2018-10-18^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-10-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be3e74a72e339a7dee3bb0766e304417
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publicationDate 2020-10-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10818547-B2
titleOfInvention Method of manufacturing semiconductor device having a structure pattern having a plurality of trenches
abstract A method of manufacturing a semiconductor device includes forming a base layer on a substrate. A structure layer is formed on the base layer. The structure layer includes at least one material layer. A structure pattern is formed on the base layer. The structure pattern includes a first trench extending in a first direction and a second trench having a cross portion extending in a second direction that is perpendicular to the first direction. The second trench is connected to the first trench. The structure pattern further includes a base pattern having a recess portion recessed downward from a surface of the base layer at the cross portion of the second trench.
priorityDate 2018-04-23^^<http://www.w3.org/2001/XMLSchema#date>
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