| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R1-06 |
| filingDate |
2018-01-03^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-11-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf9d52cf6990ca5fba804acff912e62c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fbd1a95bf10cbc8f3225757122e756c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_915827967ebfbbedc9d556f8e7a8f367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb0a22689243b921f0b0ad05e31327af |
| publicationDate |
2020-11-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10829364-B2 |
| titleOfInvention |
MEMS transducer and method for manufacturing the same |
| abstract |
A method includes the following operations: forming a piezoelectric substrate including a piezoelectric structure and a conductive contact structure, in which the piezoelectric structure has a conductive layer and a piezoelectric layer in contact with the conductive layer, and the conductive contact structure is electrically connected to the piezoelectric structure and protrudes beyond a principal surface of the piezoelectric substrate; forming a semiconductor substrate having a conductive receiving feature and a semiconductor device electrically connected thereto; aligning the conductive contact structure of the piezoelectric substrate with the conductive receiving feature of the semiconductor substrate; and bonding the piezoelectric substrate with the semiconductor substrate such that the conductive contact structure is in contact with the conductive receiving feature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022208852-A1 |
| priorityDate |
2015-03-13^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |