| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_283357e4e5b1d2334bd15817360ddd5a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C29-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C29-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2019-04-08^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-05-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c72cd7d17b8d0225aa56f1452e82a299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d67257f4f4beb55c423d571a0521b87a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38029ebcb7c113376e29472d051c99ab |
| publicationDate |
2021-05-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11004530-B2 |
| titleOfInvention |
Testing through-silicon-vias |
| abstract |
Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TSV to at least one of a test input and a test evaluation circuit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600349-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021233599-A1 |
| priorityDate |
2011-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |