| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-18 |
| filingDate |
2019-07-24^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-06^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c15a172c4908db3ded7df1efe11429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11efc5d4d8f7ad339b7ea04b2fa1e697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8bb6dc17fa94ab133f3d433e2d11e59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f82bfea31403d429fcbd18e743333dd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_defcf42fb3e24b286d40e2272188834c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_356ae8251885a90c911acad2e05f8fe4 |
| publicationDate |
2021-07-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11053604-B2 |
| titleOfInvention |
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application |
| abstract |
Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution. |
| priorityDate |
2014-10-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |