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filingDate 2020-01-28^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-08-17^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11091366-B2
titleOfInvention Nickel lanthanide alloys for MEMS packaging applications
abstract A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
priorityDate 2018-07-23^^<http://www.w3.org/2001/XMLSchema#date>
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