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filingDate 2019-03-22^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-08-17^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf82ffacfefaa677d0894f636dea3315
publicationDate 2021-08-17^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11094666-B2
titleOfInvention Bonding wire, semiconductor package including the same, and wire bonding method
abstract A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.
priorityDate 2018-09-28^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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