| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75b86e50a7529f6158517db14a0b81df |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10356
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09409 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00349
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R9-0515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R9-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-20 |
| filingDate |
2016-08-19^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-11-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e6b29cb1dbfb7522fa2930953babd7d |
| publicationDate |
2021-11-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11161146-B2 |
| titleOfInvention |
IC die, probe and ultrasound system |
| abstract |
An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed. |
| priorityDate |
2015-09-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |