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filingDate 2018-06-29^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-12-28^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad80ee85b00440501a0328e985ac08ed
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publicationDate 2021-12-28^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11211388-B2
titleOfInvention Array boundfary structure to reduce dishing
abstract A semiconductor structure including a semiconductor substrate and at least one patterned dielectric layer is provided. The semiconductor substrate includes a semiconductor portion, at least one first device, at least one second device and at least one first dummy ring. The at least one first device is disposed on a first region surrounded by the semiconductor portion. The at least one second device and the at least one first dummy ring are disposed on a second region, and the second region surrounds the first region. The at least one patterned dielectric layer covers the semiconductor substrate.
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