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filingDate 2019-10-24^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-04-26^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-04-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11316047-B2
titleOfInvention Structure and formation method of semiconductor device with monoatomic etch stop layer
abstract A method for forming a semiconductor device structure is provided. The method includes providing a substrate. The method includes forming a gate structure over the substrate. The gate structure has a first sidewall. The method includes forming a spacer element over the first sidewall of the gate structure. The method includes forming a source/drain portion adjacent to the spacer element and the gate structure. The source/drain portion has a first top surface. The method includes depositing an etch stop layer over the first top surface of the source/drain portion. The etch stop layer is made of nitride. The method includes forming a dielectric layer over the etch stop layer. The dielectric layer has a second sidewall and a bottom surface, the etch stop layer is in direct contact with the bottom surface, and the spacer element is in direct contact with the second sidewall.
priorityDate 2017-07-11^^<http://www.w3.org/2001/XMLSchema#date>
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