| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ee0c7797883477143df17e6060a26f9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-5207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-52017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04B11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-52079 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B11-00 |
| filingDate |
2019-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-07-05^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e67998f236febc4a28356d4000525412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37e1d430974224f93a042493d6e68810
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54dec27d28be37d898cd5ae8c51c53e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eef8f61421404104cc5d2447dce9c198
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef95cb0d44a6f22d020205fe6ef0e1c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be2c910a4ab1aaecd5459c0fe537836c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6334d55f1794e923d1608c305f969d1a |
| publicationDate |
2022-07-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11375980-B2 |
| titleOfInvention |
Ultrasound apparatuses and methods for fabricating ultrasound devices |
| abstract |
Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC. |
| priorityDate |
2017-11-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |