| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8321a4d88d3c45cbb4a9ebf4e9c07ec4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-16 |
| filingDate |
2021-04-01^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-09-06^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a849446f76c5f2e0343e50988e2132f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5c6f326848fa2632c39fef62ec2e19e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebdcd9261d3b27416b64b714aa433a76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d2f52d4a78b8b42915b19543b644117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fe0743d04c7300c750b9b150bae118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7180fbd8b34d5e1fc306938338bb56ca |
| publicationDate |
2022-09-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11434578-B2 |
| titleOfInvention |
Cobalt filling of interconnects in microelectronics |
| abstract |
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features. |
| priorityDate |
2015-06-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |