patent/US-11521917-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11521917-B2

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filingDate	2020-05-21^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2022-12-06^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_708de97b294efe7fe11a47b0bb082377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_695c16e1d2aa646dcbbae327d2ed378a
publicationDate	2022-12-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-11521917-B2
titleOfInvention	Semiconductor device
abstract	A semiconductor device includes a chip that includes a mounting surface, a non-mounting surface, and a side wall connecting the mounting surface and the non-mounting surface and has an eaves portion protruding further outward than the mounting surface at the side wall and a metal layer that covers the mounting surface.
priorityDate	2019-05-23^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9362366-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011290863-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447573583 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID158605

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