| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1eb9cd2af2f87dcf20b0fbbdfe79996e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S901-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67766
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-00 |
| filingDate |
2019-12-16^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2023-01-03^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12c53e3f117651c808e89ed8778bf9d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_742b13e324b3bacd051c374f7ca4d7c0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6dab3699ccac54c639812bbfd84fac6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d57ed15bb5339f5d2d235f38b1d2ff5 |
| publicationDate |
2023-01-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11542630-B2 |
| titleOfInvention |
Cleaning electroplating substrate holders using reverse current deplating |
| abstract |
Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging. |
| priorityDate |
2012-03-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |