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filingDate 2001-05-07^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-09-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2001023987-A1
titleOfInvention Method for improving adhesion to copper
abstract Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.
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