http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002180012-A1

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filingDate 2002-07-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1533615f22a529c6ac9e8b3b36b141e
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publicationDate 2002-12-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002180012-A1
titleOfInvention Graded metallic leads for connection to microelectronic elements
abstract Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9734852-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014042450-A1
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priorityDate 1998-03-27^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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