| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-451
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2002-02-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c6d8831887ddd2b647d1b946752b823 |
| publicationDate |
2003-08-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003153129-A1 |
| titleOfInvention |
Method for fabricating preplated nickel/palladium and tin leadframes |
| abstract |
A method for fabricating a leadframe structure comprising a chip mount pad and a plurality of lead segments, each having a first end near the mount pad and a second end remote from said mount pad. The structure is formed from a sheet-like starting material. In a first plating system, the leadframe is plated with a layer of nickel. Next, the second segment ends are selectively masked and a layer of palladium is selectively plated on the nickel layer on the exposed chip pad and first segments ends in a thickness suitable for wire bonding attachment. In a second plating system, the chip pad and first segment ends are selectively masked and a pure tin layer is selectively plated on the nickel layer on the exposed second segment ends in a thickness suitable for parts attachment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I595620-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013126018-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9824960-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017025329-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9461011-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017155469-A1 |
| priorityDate |
2002-02-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |