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publicationDate 2004-04-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004072396-A1
titleOfInvention Semiconductor electronic device and method of manufacturing thereof
abstract A semiconductor electronic device is disclosed, which includes a die of a semiconductor material and a holder connected electrically together by wire leads of copper, the semiconductor material die being formed with a plurality of contact pads; the device being characterized by having a welding stud bump of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad in said plurality, each copper wire lead being welded with one end on a stud bump and with the other end to said holder. This electronic device is highly reliable and can be fabricated simply at a low cost.
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