| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B2219-49134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B2219-50358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B2219-45031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P90-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B19-41815 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G05B19-418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65G49-07 |
| filingDate |
2002-12-20^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db8dcebd7ed4e3b6653fd7436753bdfd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd67cffcf28643551d6a987bebde384c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_845a1bbe6f9e42dcd26f58b6ecc9ee1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f8ca7eb3cd28dcedb4c45a1d09d68ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de43228afe8248d66002689d1b57a8df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b88a5ff46d7688ca8ae2f57e8940340
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44a3d7f6b2b0637c7a3f3394bb5379c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df5e4fa078d0ac94b88ddcb039ffdf11 |
| publicationDate |
2004-06-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2004118659-A1 |
| titleOfInvention |
Method and system for operating a semiconductor factory |
| abstract |
The present invention relates to a method and a system for operating a semiconductor factory. The factory comprises equipment ( 8 ) for processing semiconductor wafers, and an automated material handling system ( 12 ). The invention comprises clamping a wafer carrier ( 16 ) while a wafer is processed by a particular tool ( 10 ), continuing clamping the wafer carrier (16) after processing, and unclamping the wafer carrier ( 16 ) when the automated material handling system ( 12 ) is ready for removing the wafer carrier ( 16 ) from the tool ( 10 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10867823-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114518724-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019371636-A1 |
| priorityDate |
2002-12-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |