| abstract |
Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects, respectively. According to this invention, the interconnection system has also lower effective dielectric constant, which would help to reduce the signal propagation delay and reduce the signal skews. The interconnect systems consists of the signal line, inhomogeneous dielectric system consisting of the homogeneous dielectric layer and conducting or metal plans having 1-diemensioanl or 2-dimensioanl arrays in structure, located into the homogeneous dielectric layer, and the ground plan. The signal line proposed in this invention could be any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. Alternatively, the interconnect systems consists of the signal line, homogeneous dielectric layer, and the ground plan which is in 1-dimensional or 2-dimensional array in structure. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die-package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects. |