http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004175913-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32963
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L-
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
filingDate 2004-02-02^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4872c6136c70c96261cbc06854c6d4a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0110eac6a6f00fa56b643095351bce
publicationDate 2004-09-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004175913-A1
titleOfInvention End point detection in time division multiplexed etch processes
abstract An improved method for determining endpoint of a time division multiplexed process by monitoring an identified region of a spectral emission of the process at a characteristic process frequency. The region is identified based upon the expected emission spectra of materials used during the time division multiplexed process. The characteristic process frequency is determined based upon the duration of the steps in the time division multiplexed process. Changes in the magnitude of the monitored spectra indicate the endpoint of processes in the time division multiplexed process and transitions between layers of materials.
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