Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03d0f52bb4069f8a19d70dcfb697c67a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4685 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09909 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-003 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
filingDate |
2004-05-27^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cc6ae292dc30a467a8cb8ef0ae8972d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cd71abb13f99749c4f8240ff480cf1c |
publicationDate |
2004-11-04^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2004219771-A1 |
titleOfInvention |
Pattern forming method and pattern forming device |
abstract |
A pattern forming method has the steps of: forming a pattern by discharging droplets of a conductive material forming solution onto an insulating substrate; forming a conductive layer pattern on the pattern by discharging droplets of a solution which becomes a growth core; and forming a metal pattern by immersing the conductive layer pattern in a plating liquid. The pattern forming method may further have the step of forming a protective layer on a surface of the metal pattern by discharging droplets of an insulating material forming solution except at regions which are to become electrodes of the metal pattern. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019196221-A1 |
priorityDate |
2002-06-07^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |