| abstract |
The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32 , which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32 . This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured. |