| abstract |
First, through a coating step, a photolithography step and an etching step, a plurality of electrodes 142, 142 , . . . are formed on a base plate 141 . Next, a resist layer 143 b is formed on the base plate 141 so as to cover all of the electrodes 142, 142 , . . . , and by exposing and developing the resist layer 143 b , a nozzle 103 having a super minute diameter is formed to stand with respect to the base plate 141 so as to make the resist layer 143 b correspond to each electrode 142 , and an in-nozzle passage is formed in each nozzle 103. |