http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006073678-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a6c760472ee4c29e9cd26152ace2eb0
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78603
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-322
filingDate 2004-11-16^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb02c81634fcea72f48cd417aa5482a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_670df3a4666a6b312c76496fd427769c
publicationDate 2006-04-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006073678-A1
titleOfInvention System and method for hydrogen exfoliation gettering
abstract A hydrogen (H) exfoliation gettering method is provided for attaching fabricated circuits to receiver substrates. The method comprises: providing a Si substrate; forming a Si active layer overlying the substrate with circuit source/drain (S/D) regions; implanting a p-dopant into the S/D regions; forming gettering regions underling the S/D regions; implanting H in the Si substrate, forming a cleaving plane (peak concentration (Rp) H layer) in the Si substrate about as deep as the gettering regions; bonding the circuit to a receiver substrate; cleaving the Si substrate along the cleaving plane; and binding the implanted H underlying the S/D regions with p-dopant in the gettering regions, as a result of post-bond annealing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8354329-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010270658-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010244185-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010087046-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8030174-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010283103-A1
priorityDate 2004-09-28^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6806171-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6352909-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6696352-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6544862-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6607969-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6323108-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6387829-B1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359967
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID783
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129823890
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578761
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5462311
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559310
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425193155
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID123854965
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559585
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5360835

Showing number of triples: 1 to 44 of 44.