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publicationNumber US-2007054114-A1
titleOfInvention Multilayer anisotropic conductive adhesive and connection structure using the same
abstract A multilayer anisotropic conductive adhesive in which resistance to reflow is sufficiently obtained and which can facilitate connection and a connection structure using the multilayer anisotropic conductive adhesive are provided. n A multilayer anisotropic conductive adhesive 11 includes a plurality of adhesive layers 1 and 2 laminated, each of which at least contains an insulating resin and a hardening agent; wherein conductive particles are contained either in the plurality of adhesive layers 1 or in the plurality of adhesive layers 2, and at least the top or bottom adhesive layer 1 has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Further, a connection structure is constructed in which a first electronic component that has an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the above-described multilayer anisotropic conductive adhesive 11.
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