Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_203e4f8d4be52c0ccd412189c17ec30b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14a1b7cb05efdd70d7b6ae8694137e6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_85b1f44f43b04107c17b96e77868a4a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32d39c78a6d5a363022aae728618d765 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0394 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-05 |
filingDate |
2006-08-29^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8792d3aadcac9ebceee923f20f6a1d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47f78501aff1b8aaccabb782af9dfba9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91784a9ebefbea8ade08d8c6751aaa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e32317d4d0667d977171fac625f49d5c |
publicationDate |
2007-03-22^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2007064054-A1 |
titleOfInvention |
Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing |
abstract |
Flex circuits for use in ink jet printers. In particular, flex circuits for use in ink jet printers that include a polyester material layer supporting a plurality of metal conductors, with the polyester material being a material suitable for use in an ink environment with lower ink permeability and low moisture and ink absorption than polyimide (PI) material. The polyester layer having low ink permeability and moisture and ink absorption to prevent: catastrophic “ink shorting of conductors” failures; adhesion failures; corrosion failures by direct ink contact with the conductors; and material degradation failures that may result if any of the materials are degraded by or react with the ink. Preferably, the polyester material is polyethylene naphthalate (PEN). The polyester base layer is suitable for use in many major flex circuit construction types, including: both adhesive-less and adhesive-based circuits; and one-metal and two-metal layer circuits. Also, a method of producing an improved splice in a continuous Tab Automated Bonding (TAB) style strip of circuits, using a suitable polymer material layer, that is stronger per area than other splices. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11304308-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007084619-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010051085-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8662640-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7871150-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11266014-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11382210-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016073495-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11690172-B2 |
priorityDate |
2005-08-29^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |