| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c78d80e9d323ad7c79518c80e0b8d16 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2005-11-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_743ab128ea9c7819aab91815af1f7be7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38984560b1f118015066d7d2203c3567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dd0a230c632a73bea41e32808e3fcde
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_256777083f8f09a72f4e10b98558e284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec8c042c30790c57360cd58b0dcba843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50eb7fd2914de1b50f2965e54409a0a6 |
| publicationDate |
2007-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007111522-A1 |
| titleOfInvention |
Formation of metal silicide layer over copper interconnect for reliability enhancement |
| abstract |
A method of fabrication of a sputtered metal silicide layer over a copper interconnect. We form a dielectric layer over a conductive layer. We form an interconnect opening in the dielectric layer. We form a copper layer at least filling the interconnect opening. We planarize the copper layer to form a copper interconnect in the interconnect opening. The copper interconnect is over polished to form a depression. We form metal silicide layer over the copper interconnect using a low temperature sputtering process. We can form a cap layer over the metal silicide layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009174033-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013307151-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9034664-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106564853-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008228878-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7544601-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007128847-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10043708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016104680-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014008804-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9030016-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012252208-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8828865-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8143162-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11569362-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8026556-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102915958-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010025852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009212334-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009275195-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007228571-A1 |
| priorityDate |
2005-11-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |