| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6be8e6786af95930907154365f592a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7d2dedd72617c4a012339fe37347d27 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09718
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-957
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-43 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-232
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-62 |
| filingDate |
2006-12-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b26aa938f7512bf2fa03f7c0c1bdc11f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfcd0812c80ff4c944dd0d6ca7b8ada0 |
| publicationDate |
2008-06-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008137263-A1 |
| titleOfInvention |
Method of fabricating a microelectronic device includling embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method |
| abstract |
A microelectronic device, a method of fabricating the device, and a system including the device. The method includes: providing a substrate including an underlying conductive layer and a polymer build-up layer overlying the underlying conductive layer; providing a passive microelectronic structure; embedding the passive structure in the polymer build-up layer of the substrate; and patterning the passive structure after embedding, patterning including over-etching the bottom electrode layer. The passive microelectronic structure being embedded includes an unpatterned bottom electrode layer; an unpatterned capacitor dielectric layer overlying the bottom electrode layer; and an unpatterned top electrode layer overlying the capacitor dielectric layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10923443-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015221608-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10319522-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014097525-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021151393-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11652071-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9691727-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020312793-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9018752-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015156880-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11195661-B2 |
| priorityDate |
2006-12-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |